The Single Anode Chamber (SAC) in a copper plating system delivers copper ions into the electrolyte solution for deposition onto the wafer. This enables a high purity performance and reliable copper plating process within the LAM Sabre Tool.
The Single Anode Chamber (SAC) has a highly optimized disposable capsule filter to capture copper sludges in the plating solution. The SlurriGard™-ECP filter is specifically designed for this purpose.
