Description
BuffaEtch™ III is a superior advanced duo-retention mechanisms filtration for Dilute HF and BOE cleaning, DIW, UPW or wafer bumping Electro-Copper-Plating applications. Made of Optimized Highly Asymmetric Polyethersulfone membrane (HAPES) with PP support, the filter is used easily with aqueous chemicals without any pre-wetting processes. Besides offering in lengths from 4” to 30”, there is also a combination of different endcaps configuration available for both single and multi-round filter housing installations. Cleanliness options are available.
Recommended for use in wide range of water and chemical filtration processes. Highly specialised performance filter for electro copper plating in wafer bumping process available.
