ELECTRO COPPER PLATING (ECP)

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Description

Ideal for Copper Plating, the CoopaGard™ range of filters are highly effective and economical in electro copper plating applications. The proprietary hydrophilic membrane is non-interactive with plating chemistry. The E-grade extraction treatment ensures extremely low level of organics and metallic contamination control to prevent pitting or poor adhesion. A high purity performance and reliable Copper plating processes is assured. CoopaGard™ filters are applicable to LAM Sabre tools.

The Mycropore Product Management team can assist you in the application of a suitable and effective filter that will meet the desired outcomes of your ECP process. We have proven experience in Copper Plating processes of Damascene and Through-Hole Silicon Via (TSV) applications. Optimized performance can be achieved with the application of Hydrophilic membranes with low extractable.